RON CIRCUITS LIMITED CO.LTD

Feature

Condltlon

Current

2008

Plating Capability

Aspect Ratio(Depth Diameter)

Mechanical Through Hole

15:01

20:01

Laser Blind via

Solder Mask

Minimum S/M Dam

Minimum

3mil

3mil

Minimum S/M Opening

Minimum

2mil

1.5mil

Surface Finish

Organic Solderability Preservative(OSP)

Yes

Yes

Electroless Nickel /Immersion Gold(ENIG)

Yes

Yes

Selective OSP/ENIG

Yes

Yes

Hot Air Solder Leverling (HASL)

Yes

Yes

Immersion Silver

Yes

Yes

Immersion Tin

Yes

Yes

Carbon Ink

Yes

Yes

Electric Test Capability

BGA pith

Minimum

16mil

16mil

Connector Pitch

Minimum

8mil

8mil

Pad Size

8mil

8mil

Board thickness

1

1.33

Cpk

Dimension

Etch feature to Etch feature

1

1.33

Etch feature to Hole

1

1.33

Hole to Hole

1

1.33

Hole to Edge

1

1.33

Edge to Edge

1

1.33

Impedance

1

1.33

Embedded Passive

Embedded Capacitor

Polymer Thick Film

No

Yes

Flexible

Thin Film

Normal DK

No

Yes

High DK

No

Yes

Embedded Resistor

Polymer

Thick Film

With Laser trim

No

No

w/o Laser trim

No

Yes

Metal Film

250ohm/Sq&under

No

Yes

500ohm/Sq&under

No

Yes